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Overview of Quartz Base Material Grades

Overview of Quartz Base Material Grades
Materials Raw material Production Characteristics/Special features Products and applications
CFQ 099 P
E
Standard quartz glass for industry grade Bar, plate and tube material
HSQ 100 P
E
Quartz glass of semiconductor quality Bar, plate and tube material
HSQ 300 P
E
Quartz glass of semiconductor quality, thermally stable up to 1160 °C (preliminary: 1300 °C), low heat conductivity of 1,38–2,68 W/mK, alkali metal content < 1.5 ppm, OH content < 30 ppm Semiconductor processes with various high purity requirements from room temperature to high temperatures: CVD tubes, diffusion furnaces, epitaxy chambers, etching systems; optical applications; tubes, bars, rods, blocks, HSQ 330 P E Tubes, bars, rods, blocks, plates, discs plates, discs, flanges
HSQ 330 P
E
Tubes, bars, rods, blocks, plates, discs with guaranteed chemical purity Semiconductor processes with various high purity requirements from room temperature to high temperatures: CVD tubes, diffusion furnaces, epitaxy chambers, etching systems; optical applications; tubes, bars, rods, blocks, HSQ 330 P E Tubes, bars, rods, blocks, plates, discs plates, discs, flanges
HSQ 400 P
E
Temperature resistance by specific
recrystallization
Long-term high-temperature processes over 1160 °C
HSQ 700 P
E
Low alkali content by particle size of higher purity, alkali metal/OH content
(< 0.05 ppm / < 30 ppm)
Semiconductor processes with very high purity requirements
HSQ 800 P
E
Low alkali content and temperature resistance by specific recrystallization Long-term high-temperature processes over 1160 °C with maximum purity requirements
HSQ 900 SF
S
Ultra-pure, OH < 0.2 ppm, highest total impurities in the ppb range, minimum number of defect centers Applications with highest requirements for highest purity, e. g. semiconductor processes
HSQ 910 SF
S
Ultra-pure, OH < 250 ppm, total impurities in the ppb range, minimum number of defect centers Applications with highest requirements for highest purity, e. g. semiconductor processes
HSQ 351 P
F
OH content 175 ppm Diffusion barrier with highest purity requirements
HSQ 751 P
F
OH content 175 ppm, higher purity Diffusion barrier with highest purity requirements and low bubble content
OM 100 P
C
Opaque material of highest purity with micropores, IR and temperature screening, diffuse reflection in the infrared and optical wavelength range Thermal insulator, IR stopper with semiconductor purity, spacers, flanges, plates
OFM 70 Rotosil® P
A
Opaque material, highly resistant to corrosion, high temperatures, thermal shocks and electrical influences, tolerates high concentrations of sulphuric acid and hot chlorination of metal batch mixtures and minerals Tubes, crucibles, plates, flanges for precious metal recycling, luminescent material industry, high temperature processes electric filter production, chemical technology (container, tubes, dishes etc.), hot chlorination to clean or separate substances, calcination and pyrolytic deposition
OFM 370 P
A
Like OFM-70, but higher chemical purity onto substrates
OFM 970 SF S Like OFM-70, but synthetic purity
P = pegmatite, NRC = natural rock crystal, CC = cultured crystal, SF = synthetic fused silica
E = electric, F = flame, S = synthetic, C = ceramic, A = arc molten